Compute Comparison
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CDNA 2

AMD Instinct MI250X

wins

2

The AMD Instinct MI250X is AMD's CDNA 2 data center GPU.

HPC workloadsLarge model inferenceAMD ROCm deployments

Hopper

NVIDIA H100 SXM5 80GB

wins

3

The H100 SXM5 is the high-performance form factor of the H100.

LLM trainingMulti-GPU NVLink clustersHigh-throughput inference

Performance comparison

Visual bars — winner highlighted

AMD Instinct MI250X

Metric

NVIDIA H100 SXM5 80GB

FP16 TFLOPS

383 T
989 T

Bandwidth

3.3k GB/s
3.4k GB/s

VRAM

1.3k GB
803 GB

TDP (lower=better)

560 W
700 W

TFLOPS/watt

0.68
1.41

GB/s per watt

5.85
4.79

Full specification table

SpecAMD Instinct MI250XNVIDIA H100 SXM5 80GB
ArchitectureCDNA 2Hopper
VRAM128 GB HBM2e80 GB HBM3
VRAM typeHBM2eHBM3
Memory bandwidth3,277 GB/s3,350 GB/s
FP16 TFLOPS383 TFLOPS989 TFLOPS
TDP560 W700 W
TFLOPS/watt0.68 T/W1.41 T/W
GB/s per watt5.85 GB/s/W4.79 GB/s/W
NVLinkNoYes
Release year20212022

Live cloud pricing

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Power efficiency analysis

TFLOPS/watt and GB/s/watt — critical for data center TCO

AMD Instinct MI250X

FP16 TFLOPS383 TFLOPS
TDP560 W
TFLOPS/watt0.684 T/W
GB/s per watt5.85 GB/s/W

NVIDIA H100 SXM5 80GB

FP16 TFLOPS989 TFLOPS
TDP700 W
TFLOPS/watt1.413 T/W
GB/s per watt4.79 GB/s/W

TFLOPS/watt measures compute efficiency — how much AI throughput you get per watt of power consumed. For data centers with PUE of 1.2–1.5, a 10% improvement in TFLOPS/watt translates directly to lower electricity costs and cooling requirements. GB/s/watt measures memory bandwidth efficiency, which is the binding constraint for memory-bound LLM inference workloads.

When to choose each GPU

Choose AMD Instinct MI250X for:

  • HPC workloads
  • Large model inference
  • AMD ROCm deployments

Weaknesses / Limitations

  • Older CDNA 2 architecture — lower FP16 TFLOPS than MI300X or H100
  • ROCm software ecosystem less mature than CUDA
  • 560W TDP — high power draw for its performance tier

Choose NVIDIA H100 SXM5 80GB for:

  • LLM training
  • Multi-GPU NVLink clusters
  • High-throughput inference

Weaknesses / Limitations

  • Highest cost per H100 variant — premium over PCIe form factor
  • SXM5 form factor requires NVLink-capable server chassis
  • 700W TDP demands high-density power and cooling infrastructure