Compute Comparison
NVIDIABlackwell Ultra2025

B300 SXM6

TDP 1000W · 2800 TFLOPS · 288GB VRAM · 8000 GB/s bandwidth

The B300 SXM6 has a 1000W TDP, 2800 TFLOPS of FP16 compute, 288GB of HBM3e VRAM, 8000 GB/s memory bandwidth.

Blackwell Ultra datacenter GPU. 288GB HBM3e with 8 TB/s bandwidth. Successor to B200 with higher memory and compute.

VRAM
288GB
HBM3e
FP16
2.8k
TFLOPS
Bandwidth
8.0k
GB/s
TDP
1000W
power
Best for:Frontier LLM trainingMassive multi-GPU clustersTrillion-parameter models

B300 SXM6 has 288GB of memory. Compare its specs and listed cloud rental prices below. The workload must fit in VRAM with room for runtime memory; a listed price does not confirm stock.

B300 SXM6 Overview

The B300 SXM6 is a Blackwell Ultra-generation NVIDIA GPU built on the GB300 architecture, manufactured on a TSMC 4NP process node with 208 billion transistors. Released in 2025, it delivers 2800 TFLOPS of FP16 throughput and 2800 TFLOPS BF16 — the two precision formats most commonly used for transformer model training and inference. FP8 precision is supported at 5600 TFLOPS — roughly 2.0× the FP16 rate — enabling near-doubled throughput for inference workloads that can tolerate reduced numerical precision with calibration. The GB300 architecture represents NVIDIA's approach to balancing compute throughput, memory bandwidth, and power efficiency for data center AI workloads. At 1000W TDP, the B300 SXM6 sits in the ultra-high-power data center tier (1000W), requiring specialized rack infrastructure with high-density power delivery.

Memory capacity is 288GB of HBM3e with 8000 GB/s bandwidth. This determines which models can run without quantization: approximately 144B parameters at FP16 (2 bytes/param), 288B at INT8 (1 byte/param), or up to 576B parameters at INT4/GGUF quantization (0.5 bytes/param). These figures are theoretical maximums — actual capacity is reduced by KV cache, framework overhead, and activation memory, typically by 10–20% for inference and 30–40% for training. The arithmetic intensity ceiling — the ratio of compute (2800 TFLOPS) to memory bandwidth (8000 GB/s) — is approximately 350 FLOP/byte. Transformer inference is typically memory-bound below this threshold, meaning the 8000 GB/s bandwidth figure is the primary determinant of tokens-per-second for most LLM serving workloads.

Multi-GPU configurations are a first-class use case for the B300 SXM6. NVLink 5.0 / PCIe 6.0 provides 1800 GB/s of bidirectional NVLink bandwidth between cards, enabling tensor-parallel inference across multiple GPUs with near-linear VRAM scaling. A two-card configuration provides 576GB of pooled VRAM — sufficient for 288B parameter models at FP16 — while a four-card setup reaches 1152GB. NVLink's low-latency, high-bandwidth fabric makes all-reduce operations in data-parallel training significantly faster than PCIe-based alternatives, which top out at ~64 GB/s bidirectional for PCIe 5.0 x16.

The primary workloads for the B300 SXM6 are Frontier LLM training, Massive multi-GPU clusters, Trillion-parameter models. Blackwell Ultra datacenter GPU. 288GB HBM3e with 8 TB/s bandwidth. Successor to B200 with higher memory and compute. Key limitations to factor into your evaluation: Very limited cloud availability — still ramping supply; Extremely high cost — enterprise/hyperscaler pricing only; Requires NVLink 5.0 infrastructure for multi-GPU setups. When comparing this GPU against alternatives at similar price points, the most important metrics are memory bandwidth (for inference throughput), VRAM capacity (for model size), and FP16/BF16 TFLOPS (for training speed). Raw TFLOPS figures can be misleading for inference — a GPU with lower TFLOPS but higher memory bandwidth will often outperform a higher-TFLOPS card on tokens-per-second for memory-bound autoregressive generation.

In the broader GPU market, the B300 SXM6 is a one-year-old design that remains competitive for most workloads. CUDA compatibility is a significant advantage: the B300 SXM6 benefits from the full NVIDIA software ecosystem including cuDNN, TensorRT, FlashAttention, and all major inference frameworks (vLLM, TGI, TensorRT-LLM). CUDA's maturity means optimized kernels are available for virtually every model architecture. For cloud rental, availability varies significantly by provider — some specialize in this GPU tier while others may have limited stock. Compare on-demand and spot pricing across providers using the rental comparison table on this page, and factor in region availability if latency is a concern for your inference workload.

Memory

VRAM288 GB
Memory TypeHBM3e
Bandwidth8000 GB/s
NVLink BW1800 GB/s

Compute Performance

FP3260 TFLOPS
FP162800 TFLOPS
BF162800 TFLOPS
FP85600 TFLOPS
FP418000 TFLOPS
INT85600 TOPS

Hardware Specifications

Chip

ArchitectureGB300
GenerationBlackwell Ultra
Process NodeTSMC 4NP
Transistors208B
Release DateJanuary 1, 2026

Memory

VRAM288 GB
Memory TypeHBM3e
Memory Bus8192-bit
Bandwidth8000 GB/s
NVLink BW1800 GB/s

Power

TDP1000 W
InterconnectNVLink 5.0 / PCIe 6.0

Relative Performance

FP16 Compute37%
VRAM Capacity100%
Mem Bandwidth50%

Relative to highest-spec GPU in database

Limitations

Very limited cloud availability — still ramping supply
Extremely high cost — enterprise/hyperscaler pricing only
Requires NVLink 5.0 infrastructure for multi-GPU setups

Live Cloud PricingOn-demand hourly rates

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Use Case Guidance

Frontier LLM training
Massive multi-GPU clusters
Trillion-parameter models

LLM Model Size Guidance

Max model (FP16)~144Bparameters at FP16 precision
Max model (INT8)~288Bparameters at INT8 precision
Max model (INT4)~576Bparameters at INT4/GGUF

Estimates only. Actual capacity depends on context length, KV cache, and framework overhead.

Related Guides

LLM APIs Running on This GPU Class

Providers that serve frontier LLM inference on Blackwell Ultra-class hardware.

Browse all 42 LLM models

B300 SXM6 vs Alternatives — Spec Comparison

SpecB300 SXM6 thisGB300 SXM6B300 SXM 262GBGB300 SXM 288GB
VRAM288GB HBM3e▲288GB HBM3e▲262GB HBM3e288GB HBM3e▲
Memory Bandwidth8000 GB/s▲8000 GB/s▲8000 GB/s▲8000 GB/s▲
FP16 TFLOPS2800▲2800▲2800▲2800▲
BF16 TFLOPS2800▲2800▲2800▲2800▲
FP8 TFLOPS5600▲5600▲5600▲5600▲
INT8 TOPS5600▲5600▲5600▲5600▲
TDP1000W1200W▲1000W1200W▲
Process NodeTSMC 4NP▲TSMC 4NP▲TSMC 4NP▲TSMC 4NP▲
ArchitectureGB300▲GB300 Grace Blackwell▲GB300▲GB300 Grace Blackwell▲
Release Year2025▲2025▲2025▲2025▲
Max model (FP16)~144B params▲~144B params▲~131B params~144B params▲
Max model (INT4)~576B params▲~576B params▲~524B params~576B params▲
▲ indicates best value in row · FP16/BF16 TFLOPS at full precision · Max model estimates at 2 bytes/param (FP16) and 0.5 bytes/param (INT4)Full side-by-side comparison

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B300 SXM6 Frequently Asked Questions

What is the B300 SXM6 TDP?

The B300 SXM6 has a TDP (Thermal Design Power) of 1000W.

How many TFLOPS does the B300 SXM6 have?

The B300 SXM6 delivers 2800 TFLOPS of FP16 compute and 2800 TFLOPS BF16, and 5600 TFLOPS FP8.

How much VRAM does the B300 SXM6 have?

The B300 SXM6 has 288GB of HBM3e VRAM.

What is the B300 SXM6's memory bandwidth?

The B300 SXM6 has a memory bandwidth of 8000 GB/s.

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